Chip-on-Board (COB) LED chips sib xyaw ua ke ntau LED tuag ncaj qha mus rau ib qho substrate, tsim cov qauv compact tsis muaj ib tus neeg ntim, ua kom muaj lumen ceev thiab teeb pom kev zoo. Cov qauv tseem ceeb nta liab qab semiconductor tuag, feem ntau yog tsim los ntawm indium gallium nitride (InGaN) rau xiav lub teeb emission, sib raug zoo rau lub substrate siv nyiaj paste los yog eutectic txoj kev. Ib txheej phosphor tsis sib xws, feem ntau yttrium aluminium garnet (YAG) doped nrog cerium, coats tuag array los hloov lub teeb xiav rau hauv dawb lossis lwm yam spectra. Kev sib txuas siv kub lossis txhuas hlau sib txuas, lossis tig-chip thev naus laus zis rau hlau- sib dhos dawb, txhim kho kev ntseeg tau. Lub rooj sib txoos yog encapsulated nyob rau hauv thermally conductive epoxy resin rau kev tiv thaiv thiab tshav kub dissipation, nrog rau lub substrate ua raws li lub tshav kub dab dej puag.
Substrates sib txawv: ceramic (alumina lossis aluminium nitride) rau cov thermal conductivity zoo dua (txog 170 W / m·K), lossis txhuas / tooj liab PCBs rau tus nqi- ua tau zoo hauv qis dua - daim ntawv thov fais fab. Cov lus qhia tshwj xeeb suav nrog lub teeb -emitting nto (LES) qhov ntau thiab tsawg los ntawm 4.5mm txog 32mm, lub zog ntsuas txog 300W rau siab- cov zis modules, efficiency ntawm 80-160 lm/W, xim rendering Performance index (CRI) 70-95, xim kub 2200K5-560 cov sij hawm tsawg tshaj li lub neej, thermal 2200K-560 teev tsis kam. COB tsim tau zoo hauv cov teeb pom kev zoo thiab cov teeb pom kev zoo, muab kev tswj xyuas kom sov zoo thiab sib xws li SMD counterparts.
