LED ntim yog hais txog lub encapsulation thiab sib dhos ntawm LED chips rau hauv kev ua haujlwm, tiv thaiv lub semiconductor tuag thaum ua kom muaj kev sib txuas hluav taws xob, cua sov dissipation, thiab lub teeb emission. Nws cuam tshuam rau kev ua haujlwm, durability, thiab kev thov kom haum. Cov hom tseem ceeb muaj xws li:
- Dual Hauv - kab pob (DIP): Kev lig kev cai dhau los ntawm - qhov ntim ntim nrog cov txhuas txuas rau hauv Circuit Court boards. Feem ntau siv rau hauv qhov taw qhia teeb, nws yog tus nqi - zoo tab sis loj, nrog epoxy resin encapsulation rau kev tiv thaiv yooj yim. Tsim nyog rau qis- cov ntawv siv hluav taws xob zoo li cov duab.
- Surface Mount Device (SMD): Compact chips mounted ncaj qha rau PCBs, tshem tawm cov hlau lead rau me me. Subtypes xws li 2835 (npaum, ib qho -xim), 3528 (tsawg- zog), thiab 5050 (RGB-muaj peev xwm nrog ntau yam tuag) muaj ntau yam rau cov teeb pom kev zoo thiab cov ntxaij vab tshaus. Lawv muab kev tswj kom sov zoo dua thiab automation compatibility.
- Chip on Board (COB): Ntau qhov liab qab LED tuag sib txuas ncaj qha mus rau lub substrate (piv txwv li, ceramic lossis aluminium), coated nrog phosphor rau teeb pom kev zoo. Zoo tagnrho rau siab -lumen outputs nyob rau hauv tsom teeb thiab downlights, nrog superior thermal conductivity tab sis siab sib dhos complexity.
- Mini / Micro LED hauv pob (MIP): Advanced micro- nplai ntim rau zoo- cov lus qhia suab, sib txuas cov mini-LEDs hauv cov qauv tiv thaiv. Muab cov kev daws teeb meem siab thiab qhov sib piv, siv hauv cov TV hwm.
- Glue on Board (GOB): Ib qho kev tiv thaiv ntawm SMD / COB nrog ntxiv epoxy kua nplaum rau kev cuam tshuam, feem ntau hauv kev sib tham sib qhia.
Cov hom tshiab xws li Chip Scale Package (CSP) txo qhov loj me rau cov khoom siv. Kev xaiv nyob ntawm lub zog, qhov loj, thiab ib puag ncig.
